System performance using cooling configuration information

ABSTRACT

A method, system, and computer program product for improving system performance using cooling configuration information are provided in the illustrative embodiments. A set of components in a data processing system is indexed according to corresponding amounts of cooling available to the components in the set. Priorities are assigned to component users in a set of component users. Using a processor and a memory, a component whose index value represents a higher than threshold amount of cooling availability to the component is allocated to a component user whose priority is higher than a threshold priority.

BACKGROUND

1. Technical Field

The present invention relates generally to a method, system, andcomputer program product for improving performance of a data processingsystem component. More particularly, the present invention relates to amethod, system, and computer program product for improving systemperformance using cooling configuration information of the systemcomponents.

2. Description of the Related Art

Data processing systems can be configured in a variety of ways. Forexample, the components in a data processing system may be configured tooperate in a manner such that the data processing system behaves as asingle data processing unit. The memory in such a configuration operatesto support data manipulation for the single data processing unit.

As another example, data processing systems can be divided into logicalpartitions (LPARs). Such data processing systems are also known aslogical partitioned data processing systems. A logical partition is alsoknown simply as a “partition.” Each partition operates as a separatedata processing system independent of the other partitions. Generally, apartition management firmware component manages partitions through theircreation and subsequent assignment of hardware components. A Hypervisoris an example of such partition management firmware.

Electronic components in a data processing system produce heat as abyproduct of their operation. Typically, the heat is dissipated from thedata processing system using a cooling medium, such as air or a liquidcoolant (collectively referred to as “coolant”).

SUMMARY

The illustrative embodiments provide a method, system, and computerprogram product for improving system performance using coolingconfiguration information. An embodiment indexes a set of components ina data processing system according to corresponding amounts of coolingavailable to the components in the set. The embodiment assignspriorities to component users in a set of component users. Theembodiment allocates, using a processor and a memory, a component whoseindex value represents a higher than threshold amount of coolingavailability to the component to a component user whose priority ishigher than a threshold priority.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The novel features believed characteristic of the invention are setforth in the appended claims. The invention itself, however, as well asa preferred mode of use, further objectives and advantages thereof, willbest be understood by reference to the following detailed description ofan illustrative embodiment when read in conjunction with theaccompanying drawings, wherein:

FIG. 1 depicts a block diagram of a data processing system in which theillustrative embodiments may be implemented;

FIG. 2 depicts a block diagram of an example logically partitionedplatform in which the illustrative embodiments may be implemented;

FIG. 3 depicts a block diagram of an example cooling configuration in adata processing system, the information about which can be used inaccordance with an illustrative embodiment;

FIG. 4 depicts example data structures configured for improving systemperformance using cooling configuration information in accordance withan illustrative embodiment;

FIG. 5 depicts a block diagram of an example process for improvingsystem performance using cooling configuration information in accordancewith an illustrative embodiment;

FIG. 6 depicts a flowchart of a process for improving system performanceusing cooling configuration information in accordance with anillustrative embodiment;

FIG. 7 depicts a flowchart of an example process of reconfiguring acomponent for improving system performance using cooling configurationinformation in accordance with an illustrative embodiment; and

FIG. 8 depicts a flowchart of an example process for reducing operatingcost and improving system performance using cooling configurationinformation in accordance with an illustrative embodiment.

DETAILED DESCRIPTION

Within the scope of this disclosure, a component of a data processingsystem can be any electrical or electronic component, such as, forexample, a memory card, a processor chip, a controller board, anadapter, or a power supply. The illustrative embodiments recognize thatthe performance of a component depends on the effectiveness of heatremoval from the component. A relatively cooler component can beconfigured to perform better than a relatively hotter component of asimilar type.

Consider air as an example coolant. The illustrative embodimentsrecognize that the location of a component in the airflow path through adata processing system is a factor in determining how effectively theairflow can remove heat from that component. A component that is closestto the airflow inlet receives the best heat exchange rate from theairflow and will be cooled the most. As the air passes over componentsprogressively farther from the inlet, the air is increasingly heated,and the farther components receive progressively decreasing heatexchange rate from the airflow. Thus, the illustrative embodimentsrecognize that in a component closer to the coolant inlet performs orcan be configured to perform better than a comparable component fartheraway from the coolant inlet.

For example, a processor closer to an airflow inlet can be operated at aclock speed higher than the clock speed of a comparable processorfarther away from the inlet in relation to the first processor. Aprocessor operating at a relatively higher clock speed can processlarger workloads than another comparable processor operating at arelatively lower clock speed.

Presently, in a multi-partition system with a controlling hypervisor,the hardware component assignment to partitions is done withoutconsidering chip location. Presently, the components are numbered byfirmware and the first available component from a set of comparablecomponents is assigned to the partition.

Sometimes a system assigns certain components together as a group. Forexample, a group of processors may be assigned to a partition togetherin order to maintain system affinity for processors that are on the samechip or are otherwise closely tied together.

The illustrative embodiments recognize that present component assignmenttechniques do not consider the cooling configurations of the variouscomponents when making assignments of partition resources. Thus, theillustrative embodiments recognize that at least some assignments ofcomponents to partitions are not optimal for partition performance,overall system performance, or both, in a given system configuration.

A cooling configuration of a component includes the positioning of thecomponent relative to a coolant flow, obstructions affecting the coolantflow to the component, or a combination thereof. Information about acooling configuration describes such positioning, obstructions, or acombination thereof.

The illustrative embodiments used to describe the invention generallyaddress and solve the above-described problems and other problemsrelated to system performance due to hardware component coolingconfigurations. The illustrative embodiments provide a method, system,and computer program product for improving system performance usingcooling configuration information.

For example, an embodiment uses knowledge about the coolant flow througha system to make cooling configuration aware component assignments topartitions or workloads in a system. Another embodiment further usespriority information associated with component users, such as partitionsor workloads, to optimally assign components to the components userssuch that the performance of the component user or system as a whole isimproved. In one example operation, such an embodiment assigns thecoolest component to the highest priority partition, thereby allowingthat partition to achieve better performance as compared to thepartition's performance with a hotter component.

Another embodiment can help reduce the operating costs of a system byusing the cooling configuration information about the components of thesystem. For example, some systems have energy savings capabilities wherea component can be powered down, placed in a low power consumption mode,or placed in a sleep mode when the component's utilization falls below athreshold utilization. An embodiment reconfigures a relatively coolercomponent to handle additional workloads. The embodiment transfers aworkload from a relatively hotter component to the relatively coolercomponent, thereby reducing the hotter component's utilization. When theembodiment has caused the hotter component's utilization to fall belowthe threshold level of utilization, the embodiment allows the system toreduce the power consumption of the hotter component, thereby reducingthe operating cost of the system.

Some systems incur license costs per component that uses a license forthe component's operation. In such configurations, another embodimentreduces the operating costs of the system by reducing the number ofcomponents using the licenses. The embodiment transfers the workload ofa relatively hotter component to a relatively cooler component. When theworkload is transferred away and the hotter component is no longer usingthe license, the embodiment allows the system to reduce the licenseusage and license cost of operating the system is reduced.

The illustrative embodiments are described with respect to certaincomponents, component users, costs, and performance measurement criteriaonly as examples. Such examples are not intended to be limiting to theinvention. For example, an illustrative embodiment described withrespect to a processor component can be implemented with respect to amemory component in a similar manner within the scope of theillustrative embodiments. As another example, an illustrative embodimentdescribed with respect to a partition can be used with respect to aworkload in a non-partitioned system in a similar manner within thescope of the illustrative embodiments.

Furthermore, the illustrative embodiments may be implemented withrespect to any type of data, data source, or access to a data sourceover a data network. Any type of data storage device may provide thedata to an embodiment of the invention, either locally at a dataprocessing system or over a data network, within the scope of theinvention.

The illustrative embodiments are described using specific code, designs,architectures, protocols, layouts, schematics, and tools only asexamples and are not limiting to the illustrative embodiments.Furthermore, the illustrative embodiments are described in someinstances using particular software, tools, and data processingenvironments only as an example for the clarity of the description. Theillustrative embodiments may be used in conjunction with othercomparable or similarly purposed structures, systems, applications, orarchitectures. An illustrative embodiment may be implemented inhardware, software, or a combination thereof.

The examples in this disclosure are used only for the clarity of thedescription and are not limiting to the illustrative embodiments.Additional data, operations, actions, tasks, activities, andmanipulations will be conceivable from this disclosure and the same arecontemplated within the scope of the illustrative embodiments.

Any advantages listed herein are only examples and are not intended tobe limiting to the illustrative embodiments. Additional or differentadvantages may be realized by specific illustrative embodiments.Furthermore, a particular illustrative embodiment may have some, all, ornone of the advantages listed above.

With reference to the figures and in particular with reference to FIGS.1 and 2, these figures are example diagrams of data processingenvironments in which illustrative embodiments may be implemented. FIGS.1 and 2 are only examples and are not intended to assert or imply anylimitation with regard to the environments in which differentembodiments may be implemented. A particular implementation may makemany modifications to the depicted environments based on the followingdescription.

With reference to FIG. 1, this figure depicts a block diagram of a dataprocessing system in which the illustrative embodiments may beimplemented. Data processing system 100 may be a symmetricmultiprocessor (SMP) system including a plurality of processors 101,102, 103, and 104, which connect to system bus 106. For example, dataprocessing system 100 may be an IBM Power System® implemented as aserver within a network. (Power Systems is a product and a trademark ofInternational Business Machines Corporation in the United States andother countries). Alternatively, a single processor system may beemployed and processors 101, 102, 103, and 104 may be cores in thesingle processor chip. Alternatively, data processing system 100 mayinclude processors 101, 102, 103, 104 in any combination of processorsand cores.

Also connected to system bus 106 is memory controller/cache 108, whichprovides an interface to a plurality of local memories 160-163. I/O busbridge 110 connects to system bus 106 and provides an interface to I/Obus 112. Memory controller/cache 108 and I/O bus bridge 110 may beintegrated as depicted.

Data processing system 100 is a logically partitioned data processingsystem. Thus, data processing system 100 may have multiple heterogeneousoperating systems (or multiple instances of a single operating system)running simultaneously. Each of these multiple operating systems mayhave any number of software programs executing within it. Dataprocessing system 100 is logically partitioned such that different PCII/O adapters 120-121, 128-129, and 136, graphics adapter 148, and harddisk adapter 149 may be assigned to different logical partitions. Inthis case, graphics adapter 148 connects to a display device (notshown), while hard disk adapter 149 connects to and controls hard disk150.

Thus, for example, suppose data processing system 100 is divided intothree logical partitions, P1, P2, and P3. Each of PCI I/O adapters120-121, 128-129, 136, graphics adapter 148, hard disk adapter 149, eachof host processors 101-104, and memory from local memories 160-163 isassigned to one of the three partitions. In these examples, memories160-163 may take the form of dual in-line memory modules (DIMMs). DIMMsare not normally assigned on a per DIMM basis to partitions. Instead, apartition will get a portion of the overall memory seen by the platform.For example, processor 101, some portion of memory from local memories160-163, and I/O adapters 120, 128, and 129 may be assigned to logicalpartition P1; processors 102-103, some portion of memory from localmemories 160-163, and PCI I/O adapters 121 and 136 may be assigned topartition P2; and processor 104, some portion of memory from localmemories 160-163, graphics adapter 148 and hard disk adapter 149 may beassigned to logical partition P3.

Each operating system executing within data processing system 100 isassigned to a different logical partition. Thus, each operating systemexecuting within data processing system 100 may access only those I/Ounits that are within its logical partition. Thus, for example, oneinstance of the Advanced Interactive Executive (AIX®) operating systemmay be executing within partition P1, a second instance (image) of theAIX operating system may be executing within partition P2, and a Linux®or IBM-i® operating system may be operating within logical partition P3.(AIX and IBM-i are trademarks of International business MachinesCorporation in the United States and other countries. Linux is atrademark of Linus Torvalds in the United States and other countries).

Peripheral component interconnect (PCI) host bridge 114 connected to I/Obus 112 provides an interface to PCI local bus 115. A number of PCIinput/output adapters 120-121 connect to PCI local bus 115 throughPCI-to-PCI bridge 116, PCI bus 118, PCI bus 119, I/O slot 170, and I/Oslot 171. PCI-to-PCI bridge 116 provides an interface to PCI bus 118 andPCI bus 119. PCI I/O adapters 120 and 121 are placed into I/O slots 170and 171, respectively. Typical PCI bus implementations support betweenfour and eight I/O adapters (i.e. expansion slots for add-inconnectors). Each PCI I/O adapter 120-121 provides an interface betweendata processing system 100 and input/output devices such as, forexample, other network computers, which are clients to data processingsystem 100.

An additional PCI host bridge 122 provides an interface for anadditional PCI local bus 123. PCI local bus 123 connects to a pluralityof PCI I/O adapters 128-129. PCI I/O adapters 128-129 connect to PCIlocal bus 123 through PCI-to-PCI bridge 124, PCI bus 126, PCI bus 127,I/O slot 172, and I/O slot 173. PCI-to-PCI bridge 124 provides aninterface to PCI bus 126 and PCI bus 127. PCI I/O adapters 128 and 129are placed into I/O slots 172 and 173, respectively. In this manner,additional I/O devices, such as, for example, modems or network adaptersmay be supported through each of PCI I/O adapters 128-129. Consequently,data processing system 100 allows connections to multiple networkcomputers.

Memory mapped graphics adapter 148 is inserted into I/O slot 174 andconnects to I/O bus 112 through PCI bus 144, PCI-to-PCI bridge 142, PCIlocal bus 141, and PCI host bridge 140. Hard disk adapter 149 may beplaced into I/O slot 175, which connects to PCI bus 145. In turn, PCIbus 145 connects to PCI-to-PCI bridge 142, which connects to PCI hostbridge 140 by PCI local bus 141.

A PCI host bridge 130 provides an interface for a PCI local bus 131 toconnect to I/O bus 112. PCI I/O adapter 136 connects to I/O slot 176,which connects to PCI-to-PCI bridge 132 by PCI bus 133. PCI-to-PCIbridge 132 connects to PCI local bus 131. PCI local bus 131 alsoconnects PCI host bridge 130 to service processor mailbox interface andISA bus access pass-through logic 194 and PCI-to-PCI bridge 132.

Service processor mailbox interface and ISA bus access pass-throughlogic 194 forwards PCI accesses destined to PCI/ISA bridge 193. NVRAMstorage 192 connects to ISA bus 196. Service processor 135 connects toservice processor mailbox interface and ISA bus access pass-throughlogic 194 through its local PCI bus 195. Service processor 135 alsoconnects to processors 101-104 via a plurality of JTAG/I2C busses 134.JTAG/I2C busses 134 are a combination of JTAG/scan busses (see IEEE1149.1) and Phillips I2C busses.

However, alternatively, JTAG/I2C busses 134 may be replaced by onlyPhillips I2C busses or only JTAG/scan busses. All SP-ATTN signals of thehost processors 101, 102, 103, and 104 connect together to an interruptinput signal of service processor 135. Service processor 135 has its ownlocal memory 191 and has access to hardware OP-panel 190.

When data processing system 100 is initially powered up, serviceprocessor 135 uses the JTAG/I2C busses 134 to interrogate the system(host) processors 101-104, memory controller/cache 108, and I/O bridge110. At the completion of this step, service processor 135 has aninventory and topology understanding of data processing system 100.Service processor 135 also executes Built-In-Self-Tests (BISTs), BasicAssurance Tests (BATs), and memory tests on all elements found byinterrogating the host processors 101-104, memory controller/cache 108,and I/O bridge 110. Service processor 135 gathers and reports any errorinformation for failures detected during the BISTs, BATs, and memorytests.

If a meaningful/valid configuration of system resources is stillpossible after taking out the elements found to be faulty during theBISTs, BATs, and memory tests, then data processing system 100 isallowed to proceed to load executable code into local (host) memories160-163. Service processor 135 then releases host processors 101-104 forexecution of the code loaded into local memory 160-163. While hostprocessors 101-104 are executing code from respective operating systemswithin data processing system 100, service processor 135 enters a modeof monitoring and reporting errors. Service processor 135 monitors typesof items including, for example, the cooling fan speed and operation,thermal sensors, power supply regulators, and recoverable andnon-recoverable errors reported by processors 101-104, local memories160-163, and I/O bridge 110.

Service processor 135 saves and reports error information related to allthe monitored items in data processing system 100. Service processor 135also takes action based on the type of errors and defined thresholds.For example, service processor 135 may take note of excessiverecoverable errors on a processor's cache memory and decide that this ispredictive of a hard failure. Based on this determination, serviceprocessor 135 may mark that resource for deconfiguration during thecurrent running session and future Initial Program Loads (IPLs). IPLsare also sometimes referred to as a “boot” or “bootstrap.”

Data processing system 100 may be implemented using various commerciallyavailable computer systems. For example, data processing system 100 maybe implemented using IBM Power Systems available from InternationalBusiness Machines Corporation. Such a system may support logicalpartitioning using an AIX operating system, which is also available fromInternational Business Machines Corporation.

Memories, such as memory 191, NVRAM 192, local memories 160, 161, 162,and 163, or flash memory (not shown), are some examples of computerusable storage devices. Hard disk 150, a CD-ROM (not shown), and othersimilarly usable devices are some examples of computer usable storagedevices including computer usable storage medium.

Those of ordinary skill in the art will appreciate that the hardwaredepicted in FIG. 1 may vary. For example, other peripheral devices, suchas optical disk drives and the like, also may be used in addition to orin place of the hardware depicted. The depicted example is not meant toimply architectural limitations with respect to the illustrativeembodiments.

With reference to FIG. 2, this figure depicts a block diagram of anexample logically partitioned platform in which the illustrativeembodiments may be implemented. The hardware in logically partitionedplatform 200 may be implemented as, for example, the correspondingcomponents depicted in data processing system 100 in FIG. 1.

Logically partitioned platform 200 includes partitioned hardware 230,operating systems 202, 204, 206, 208, and platform firmware 210. Aplatform firmware, such as platform firmware 210, is also known aspartition management firmware. Operating systems 202, 204, 206, and 208may be multiple copies of a single operating system or multipleheterogeneous operating systems simultaneously run on logicallypartitioned platform 200. These operating systems may be implementedusing IBM-i, which is designed to interface with a partition managementfirmware, such as Hypervisor. IBM-i is used only as an example in theseillustrative embodiments. Of course, other types of operating systems,such as AIX and Linux, may be used depending on the particularimplementation. Operating systems 202, 204, 206, and 208 are located inpartitions 203, 205, 207, and 209, respectively.

Hypervisor software is an example of software that may be used toimplement partition management firmware 210 and is available fromInternational Business Machines Corporation. Firmware is “software”stored in a memory chip that holds its content without electrical power,such as, for example, read-only memory (ROM), programmable ROM (PROM),erasable programmable ROM (EPROM), electrically erasable programmableROM (EEPROM), and nonvolatile random access memory (nonvolatile RAM).

Additionally, partitions 203, 205, 207, and 209 also include partitionfirmware 211, 213, 215, and 217, respectively. Partition firmware 211,213, 215, and 217 may be implemented using initial boot strap code,IEEE-1275 Standard Open Firmware, and runtime abstraction software(RTAS), which is available from International Business MachinesCorporation. When partitions 203, 205, 207, and 209 are instantiated,platform firmware 210 loads a copy of boot strap code onto partitions203, 205, 207, and 209. Thereafter, control is transferred to the bootstrap code with the boot strap code then loading the open firmware andRTAS. The processors associated or assigned to the partitions are thendispatched to the partition's memory to execute the partition firmware.

A data processing system, for example, partition 203, includesapplication 212. Application 212 comprises program instructions forcarrying out the processes of any of the various embodiments. Theprogram instructions may be stored on at least one of one or morecomputer-readable tangible storage devices (e.g., hard disk 150, NVRAM192, or a compact disk device coupled with I/O bus 112 in FIG. 1), forexecution by at least one of one or more processors (e.g., processors101-104 in FIG. 1) via at least one of one or more computer-readablememories (e.g., any of local memories 160-163 in FIG. 1). Application212 may be implemented in any form, including but not limited to a formsuitable for execution as a service, a form implemented using hardwareand software, or a form suitable for integration with anotherapplication. A component, for example, memory 240, includes componentindex table 233 and partition priority table 249 according to anembodiment.

Partitioned hardware 230 includes a plurality of processors 232-238, aplurality of system memory units 240-246, a plurality of input/output(I/O) adapters 248-262, and a storage unit 270. Each of the processors232-238, memory units 240-246, NVRAM storage 298, and I/O adapters248-262 may be assigned to one of partitions 203, 205, 207, and 209within logically partitioned platform 200, each of which partitions 203,205, 207, and 209 corresponds to one of operating systems 202, 204, 206,and 208.

Partition management firmware 210 performs a number of functions andservices for partitions 203, 205, 207, and 209 to create and enforce thepartitioning of logically partitioned platform 200. Partition managementfirmware 210 is a firmware implemented virtual machine identical to theunderlying hardware. Thus, partition management firmware 210 allows thesimultaneous execution of independent OS images 202, 204, 206, and 208by virtualizing all the hardware resources of logically partitionedplatform 200.

Service processor 290 may be used to provide various services, such asprocessing of platform errors in the partitions. These services also mayact as a service agent to report errors back to a vendor, such asInternational Business Machines Corporation. Operations of partitions203, 205, 207, and 209 may be controlled through a hardware managementconsole, such as hardware management console 280. Hardware managementconsole 280 is a separate data processing system from which a systemadministrator may perform various functions including reallocation ofresources to different partitions.

The hardware in FIGS. 1-2 may vary depending on the implementation.Other internal hardware or peripheral devices, such as flash memory,equivalent non-volatile memory, or optical disk drives and the like, maybe used in addition to or in place of certain hardware depicted in FIGS.1-2. An implementation of the illustrative embodiments may also usealternative architecture for managing partitions without departing fromthe scope of the invention.

With reference to FIG. 3, this figure depicts a block diagram of anexample cooling configuration in a data processing system, theinformation about which can be used in accordance with an illustrativeembodiment. Data processing system 302 is an example data processingsystem using all or part of data processing system 100 in FIG. 1.Components 304, 306, 308, 310, and 312 are labeled with exampleidentifiers A, B, C, D, and E, respectively. Components 304, 306, 308,310, and 312 are any number of hardware components, for example,corresponding to any number of processors similar to processor 101 inFIG. 1, or any number of local memory 161 in FIG. 1.

Coolant inlet 314 allows a suitable coolant to enter system 302 forremoving heat from components 304-312. Coolant outlet 316 allows thecoolant to exit system 302 after removing heat from components 304-312.

In the example placement of components 304-312 depicted in this figure,component 304 is positioned closest to coolant inlet 314, and component312 is positioned the farthest from coolant inlet 314. Accordingly,component 304's cooling configuration allows component 304 to receivethe most cooling, and component 312's cooling configuration allowscomponent 312 to receive the least cooling from the coolant flow betweencooling inlet 314 and cooling outlet 316. Components 306, 308, and 310receive progressively reduced cooling from the coolant flow betweencooling inlet 314 and cooling outlet 316 owing to their progressivelydistant cooling configurations from cooling inlet 314.

An embodiment uses the information about the cooling configurations ofcomponents 304-312 to assign components 304-312 to partitions orworkloads to improve performance of partitions or workloads according totheir relative priorities. An embodiment uses the information about thecooling configurations of components 304-312 to reduce the use ofrelatively hotter components, such as components 310 or 312, andincrease the use of relatively cooler components, such as components 304or 306.

As an example, an embodiment can reduce the utilization of component 312such that system 302 can place component 312 in a low power consumptionmode, thereby reducing energy-related operating costs of system 302. Asanother example, an embodiment can reduce the utilization of component312 such that system 302 can remove a license from use at component 312,thereby reducing license-related operating costs of system 302.

With reference to FIG. 4, this figure depicts example data structuresconfigured for improving system performance using cooling configurationinformation in accordance with an illustrative embodiment. Componentindex table 402 is an example of component index table 233 in FIG. 2.Partition priority table 404 is an example of partition priority table249 in FIG. 2.

Data structures 402 and 404 are described as tables only as examples andnot as a limitation on the illustrative embodiments. An implementationcan use any suitable data structure for achieving a similar result, andsuch other data structures are contemplated within the scope of theillustrative embodiments.

Table 404 is described as a “partition priority” table only as anexample and not as a limitation on the illustrative embodiments. Anycomponent user, such as a workload in a non-partitioned data processingsystem, can be prioritized in a similar manner and other component usersare contemplated within the scope of the illustrative embodiments.

Table 402 is configured to store cooling configuration information abouta set of functionally interchangeable components, or similar components,such as components 304-312 in FIG. 3. Any number of table 402 can becreated to store similar information about any number of sets of similarcomponents.

In an example embodiment, components in a set are indexed according toan amount of cooling they receive, for example, by their relativeproximity to a coolant inlet coolant inlet 314 in FIG. 3. Only as anexample, a first component receives a lower index value compared to asecond component if the first component receives more cooling, or betterheat exchange, than the second component.

Using the configuration depicted in FIG. 3, table 402 is populated withthe identifiers of the components in the set of components representedin table 402, and the components' indices. For example, component A isdepicted to have an index 0, component B an index value of 1, componentC an index value of 2, component D an index value of 3, and component Ean index value of 4, based on their relative heat exchange effectivenessin the configuration of FIG. 3.

These indices suggest that component A receives the best cooling in theset of components A-E, and component E receives the least cooling in thesame set. Using this cooling configuration information, one embodimentcan reconfigure components A-E for handling different amounts ofworkload without stressing the components beyond their operationallimits. For example, an embodiment increases the clock speed ofcomponent A more than the clock speed of components B-D, and leaves theclock speed of component E unchanged. In such a reconfiguration,component A can now process a greater workload than components B, C, D,or E, while maintaining comparable operating temperatures withcomponents B, C, D, or E.

Using partitions as example users of components A-E, assume that anycomponent from the set of components in table 402 can be assigned to anypartition P1, P2, P3, P4, or P5, depicted in table 404. Table 404 ispopulated with a priority value corresponding to each component user.For example, for some reason, partition P1 is designated the highestpriority partition with priority 0, followed by P3 as the next highestpriority with priority 1, followed by P4 as the next highest prioritywith priority 2, followed by P2 as the next highest priority withpriority 3, and followed by P5 as the lowest priority with priority 4.

An embodiment implemented in an application, such as in application 212in FIG. 2, assigns the components from the set represented in table 402to a component user represented in table 404 such that a component userwith a relatively higher priority than another component user in table404 is assigned a component with relatively better cooling than anothercomponent from table 402. Accordingly, in the depicted example, anembodiment assigns component A to partition P1, component B to partitionP3, component C to partition P4, component D to partition P2, andcomponent E to partition P5.

Furthermore, these assignments are dynamic. An embodiment can change theassignments if components are added or removed from table 402, or acomponent's cooling configuration changes, such as by becomingobstructed. An embodiment can also change the assignments if a componentuser is added or removed from table 404, or the priority associated witha component user changes.

An embodiment can further alter the assignments if an operating costreduction can be achieved. For example, after the assignments depictedin FIG. 4, an embodiment may determine that partition P5 is utilizingcomponent E below a threshold amount, and that amount of capacity isavailable in component B such that partitions P3 and P5 can sharecomponent B, reduce the utilization of component E below anotherthreshold such that component E can be placed in a low power consumptionmode.

As another example, after the assignments depicted in FIG. 4, anembodiment may determine that partition P5 is utilizing a license atcomponent E below a threshold amount, and that amount of licensecapacity is available in component B such that partitions P3 and P5 canshare a license at component B, reduce the license utilization ofcomponent E such that the license can be removed from component E.

With reference to FIG. 5, this figure depicts a block diagram of anexample process for improving system performance using coolingconfiguration information in accordance with an illustrative embodiment.Blocks 502, 504, and 506 represent the utilization of components A, B,and C respectively, from table 402 in FIG. 4.

An embodiment can further alter the assignments described with respectto FIG. 4. For example, assume that after the assignments depicted inFIG. 4, an embodiment determines that utilization 502 of component A isat level W1; utilization 504 of component B is at level W2; andutilization 506 of component C is only at level W3. The embodimentfurther determines that the amount of workload processed by component Ccan be accommodated in the spare capacity of component A.

Accordingly, the embodiment transfers the one or more workloads usingcomponent C to component A, increasing the utilization of component A bycorresponding amount W3A, and removing the utilization W3 fromutilization 506. Now, the embodiment can instruct, direct, or enable asystem to switch component C to a low power mode, thereby improving theperformance of the system by reducing the cost of executing the sameamount of workload but with less energy.

Blocks 502, 504, and 506 and the artifacts depicted therein can also beinterpreted as license usage. An embodiment can similarly instruct,direct, or enable a system to transfer license usage from component C tocomponent A in a similar manner, and remove a license from component C.Thus, an embodiment improves the performance of the system by reducingthe cost of executing the same amount of workload but with fewerlicenses.

With reference to FIG. 6, this figure depicts a flowchart of a processfor improving system performance using cooling configuration informationin accordance with an illustrative embodiment. Process 600 can beimplemented in application 212 in FIG. 2.

Process 600 begins by indexing a set of similar components according tothe amounts of cooling available to those components (step 602). Process600 assigns priorities to a set of component users, for example,partitions, that can use one or more components from the set ofcomponents (step 604).

Process 600 allocates the coolest available component from the set ofcomponents to the component user with the highest remaining priority inthe set of component users (step 606). Process 600 repeats step 606 solong as a component user in the set of component users remains in needof a component from the set of components.

Process 600 determines whether a component user has been added, removed,or reprioritized (step 608). If a component user has been added orremoved, (solid branch of “Yes” path of step 608), process 600 returnsto step 604. If a component user has been reprioritized, (dotted branchof “Yes” path of step 608), process 600 returns to step 606. If the setof component users has remained unchanged (“No” path of step 608),process 600 determines whether a component has been added or removedfrom the set of components, or the cooling configuration of a componentin the set of components has changed (step 610). If a component has beenadded or removed from the set of components, or the coolingconfiguration of a component in the set of components has changed (“Yes”path of step 610), process 600 returns to step 602. If the set ofcomponents remains unchanged (“No” path of step 610), process 600 mayend thereafter.

With reference to FIG. 7, this figure depicts a flowchart of an exampleprocess of reconfiguring a component for improving system performanceusing cooling configuration information in accordance with anillustrative embodiment. Process 700 can be implemented in application212 in FIG. 2.

Process 700 begins by selecting a component from an indexed set ofcomponents, such as the set of components in table 402 in FIG. 4 thatmay result after step 602 in FIG. 6 (step 702). Process 700 determineswhether the index of the selected component indicates that the selectedcomponent has a better cooling configuration than another component inthe set of components (step 704). If the selected component has thebetter cooling configuration (“Yes” path of step 704), process 700reconfigures the selected component to have improved performance, suchas the ability to accommodate a larger workload than the othercomponent, e.g., by increasing the clock speed of the selected componentmore than the clock speed of the other component (step 706). If theselected component does not have the better cooling configuration (“No”path of step 704), process 700 proceeds to step 708.

Process 700 determines whether more components remain in the set ofcomponents for similar reconfiguration (step 708). If more componentsremain (“Yes” path of step 708), process 700 returns to step 702 andselects another component. If no more components remain (“No” path ofstep 708), process 700 may end thereafter.

With reference to FIG. 8, this figure depicts a flowchart of an exampleprocess for reducing operating cost and improving system performanceusing cooling configuration information in accordance with anillustrative embodiment. Process 800 can be implemented in application212 in FIG. 2. In FIG. 4 and in process 800, lower thresholds areindicative of better cooling configuration only as an example for theease of conveying the operation of an embodiment. An implementation mayelect to use higher index values to indicate better coolingconfiguration in a similar manner within the scope of the illustrativeembodiments. Other manners of associating the index values to the levelsof cooling available at a component, such as symbolic or encodedindices, are also contemplated within the scope of the illustrativeembodiments.

Process 800 begins by selecting from an indexed set of components acomponent whose index is higher than a threshold index (step 802).Process 800 determines whether the workload of the selected component beaccommodated in a lower than threshold indexed component in the set(step 804). If the workload of the selected component be accommodated ina lower than threshold indexed component in the set (“Yes” path of step804, process 800 determines whether transferring the workload reduce theselected component's utilization below a threshold level of utilization(step 806).

If transferring the workload will reduce the selected component'sutilization below a threshold level of utilization (“Yes” path of step806), process 800 transfers the workload to the lower than thresholdindexed component in the set considered in step 804 (step 808).

Process 800 determines whether a mode of the selected component can beswitched to a low power consumption mode (step 810). If the mode can beswitched (“Yes” path of step 810), process 800 places the selectedcomponent in a low power mode (step 812).

If the determinations of steps 804, 806, or 810 result in a negativeanswer (“No” path of step 804), (“No” path of step 806), or (“No” pathof step 810), process 800 proceeds to step 814. Process 800 determineswhether more components remain to be considered in the set of componentsfor switching to low power mode (step 814). If more components remain tobe considered (“Yes” path of step 814), process 800 returns to step 802.If no more components are to be considered (“No” path of step 814),process 800 may end thereafter.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof code, which comprises one or more executable instructions forimplementing the specified logical function(s). It should also be notedthat, in some alternative implementations, the functions noted in theblock may occur out of the order noted in the figures. For example, twoblocks shown in succession may, in fact, be executed substantiallyconcurrently, or the blocks may sometimes be executed in the reverseorder, depending upon the functionality involved. It will also be notedthat each block of the block diagrams and/or flowchart illustration, andcombinations of blocks in the block diagrams and/or flowchartillustration, can be implemented by special purpose hardware-basedsystems that perform the specified functions or acts, or combinations ofspecial purpose hardware and computer instructions.

Thus, a computer implemented method, system, and computer programproduct are provided in the illustrative embodiments for improvingsystem performance using cooling configuration information. Using anembodiment, the performance of a data processing system can be improvedby judiciously assigning components with better cooling configurationsthan others to component users with higher priorities than others. Anembodiment further allows operating components with better coolingconfigurations to handle increased workloads, thus freeing up componentsto further improve system performance.

As will be appreciated by one skilled in the art, aspects of the presentinvention may be embodied as a system, method, or computer programproduct. Accordingly, aspects of the present invention may take the formof an entirely hardware embodiment, an entirely software embodiment(including firmware, resident software, micro-code, etc.) or anembodiment combining software and hardware aspects that may allgenerally be referred to herein as a “circuit,” “module” or “system.”Furthermore, aspects of the present invention may take the form of acomputer program product embodied in one or more computer readablestorage device(s) or computer readable media having computer readableprogram code embodied thereon.

Any combination of one or more computer readable storage device(s) orcomputer readable media may be utilized. The computer readable mediummay be a computer readable signal medium or a computer readable storagemedium. A computer readable storage device may be, for example, but notlimited to, an electronic, magnetic, optical, electromagnetic, infrared,or semiconductor system, apparatus, or device, or any suitablecombination of the foregoing. More specific examples (a non-exhaustivelist) of the computer readable storage device would include thefollowing: an electrical connection having one or more wires, a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), an optical fiber, a portable compact disc read-onlymemory (CD-ROM), an optical storage device, a magnetic storage device,or any suitable combination of the foregoing. In the context of thisdocument, a computer readable storage device may be any tangible deviceor medium that can contain, or store a program for use by or inconnection with an instruction execution system, apparatus, or device.

Program code embodied on a computer readable storage device or computerreadable medium may be transmitted using any appropriate medium,including but not limited to wireless, wireline, optical fiber cable,RF, etc., or any suitable combination of the foregoing.

Computer program code for carrying out operations for aspects of thepresent invention may be written in any combination of one or moreprogramming languages, including an object oriented programming languagesuch as Java, Smalltalk, C++ or the like and conventional proceduralprogramming languages, such as the “C” programming language or similarprogramming languages. The program code may execute entirely on theuser's computer, partly on the user's computer, as a stand-alonesoftware package, partly on the user's computer and partly on a remotecomputer or entirely on the remote computer or server. In the latterscenario, the remote computer may be connected to the user's computerthrough any type of network, including a local area network (LAN) or awide area network (WAN), or the connection may be made to an externalcomputer (for example, through the Internet using an Internet ServiceProvider).

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems) and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer program instructions. These computer program instructions maybe provided to one or more processors of one or more general purposecomputers, special purpose computers, or other programmable dataprocessing apparatuses to produce a machine, such that the instructions,which execute via the one or more processors of the computers or otherprogrammable data processing apparatuses, create means for implementingthe functions/acts specified in the flowchart and/or block diagram blockor blocks.

These computer program instructions may also be stored in one or morecomputer readable storage devices or computer readable media that candirect one or more computers, one or more other programmable dataprocessing apparatuses, or one or more other devices to function in aparticular manner, such that the instructions stored in the one or morecomputer readable storage devices or computer readable medium produce anarticle of manufacture including instructions which implement thefunction/act specified in the flowchart and/or block diagram block orblocks.

The computer program instructions may also be loaded onto one or morecomputers, one or more other programmable data processing apparatuses,or one or more other devices to cause a series of operational steps tobe performed on the one or more computers, one or more otherprogrammable data processing apparatuses, or one or more other devicesto produce a computer implemented process such that the instructionswhich execute on the one or more computers, one or more otherprogrammable data processing apparatuses, or one or more other devicesprovide processes for implementing the functions/acts specified in theflowchart and/or block diagram block or blocks.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiments were chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

What is claimed is:
 1. A computer implemented method for improvingsystem performance using cooling configuration information, the methodcomprising: indexing a set of components in a data processing systemaccording to corresponding amounts of cooling available to thecomponents in the set, wherein an amount of cooling available to acomponent in the set of components is dependent upon a coolingconfiguration of the component in the data processing system, andwherein the cooling configuration includes a measure of a proximity ofthe component to a coolant inlet in the data processing system;assigning priorities to component users in a set of component users; andallocating, using a processor and a memory, a component whose indexvalue represents a higher than threshold amount of cooling availabilityto the component to a component user whose priority is higher than athreshold priority.
 2. The method of claim 1, further comprising:selecting a first component whose index value is indicative of bettercooling configuration than a cooling configuration of a second componentin the set of components; and reconfiguring the first component todeliver a better performance than the second component.
 3. The method ofclaim 2, wherein the reconfiguring comprises: increasing a clock speedof the first component to more than a clock speed of the secondcomponent.
 4. The method of claim 2, further comprising: transferring aworkload from the second component to the first component; and placingthe second component in a low power consumption mode.
 5. The method ofclaim 4, further comprising: evaluating whether the workload from thesecond component can be transferred to the first component; andanalyzing whether the transferring will allow the second component to beplaced in the low power consumption mode, wherein the transferring andthe placing being responsive to the evaluating and the analyzing beingaffirmative.
 6. The method of claim 2, further comprising: transferringa workload from the second component to the first component; andremoving a license from use in the second component, wherein the licensewas used to execute the workload at the second component.
 7. The methodof claim 1, wherein a priority assigned to a component user in the setof component users is indicative of a relative importance of thecomponent user in the set of component users.
 8. The method of claim 1,wherein the components in the set of components are functionally similarto one another.
 9. The method of claim 1, wherein the component users inthe set of component users are partitions in the data processing system.10. The method of claim 1, wherein the components in the set ofcomponents are processors in the data processing system.
 11. A computerusable program product comprising a computer usable storage deviceincluding computer usable code for improving system performance usingcooling configuration information, the computer usable code comprising:computer usable code for indexing a set of components in a dataprocessing system according to corresponding amounts of coolingavailable to the components in the set, wherein an amount of coolingavailable to a component in the set of components is dependent upon acooling configuration of the component in the data processing system,and wherein the cooling configuration includes a measure of a proximityof the component to a coolant inlet in the data processing system;computer usable code for assigning priorities to component users in aset of component users; and computer usable code for allocating, using aprocessor and a memory, a component whose index value represents ahigher than threshold amount of cooling availability to the component toa component user whose priority is higher than a threshold priority. 12.The computer usable program product of claim 11, further comprising:computer usable code for selecting a first component whose index valueis indicative of better cooling configuration than a coolingconfiguration of a second component in the set of components; andcomputer usable code for reconfiguring the first component to deliver abetter performance than the second component.
 13. The computer usableprogram product of claim 12, wherein the reconfiguring comprises:computer usable code for increasing a clock speed of the first componentto more than a clock speed of the second component.
 14. The computerusable program product of claim 12, further comprising: computer usablecode for transferring a workload from the second component to the firstcomponent; and computer usable code for placing the second component ina low power consumption mode.
 15. The computer usable program product ofclaim 14, further comprising: computer usable code for evaluatingwhether the workload from the second component can be transferred to thefirst component; and computer usable code for analyzing whether thetransferring will allow the second component to be placed in the lowpower consumption mode, wherein the transferring and the placing beingresponsive to the evaluating and the analyzing being affirmative. 16.The computer usable program product of claim 11, wherein the computerusable code is stored in a computer readable storage medium in a dataprocessing system, and wherein the computer usable code is transferredover a network from a remote data processing system.
 17. The computerusable program product of claim 11, wherein the computer usable code isstored in a computer readable storage medium in a server data processingsystem, and wherein the computer usable code is downloaded over anetwork to a remote data processing system for use in a computerreadable storage medium associated with the remote data processingsystem.
 18. A data processing system for improving system performanceusing cooling configuration information, the data processing systemcomprising: a storage device including a storage medium, wherein thestorage device stores computer usable program code; and a processor,wherein the processor executes the computer usable program code, andwherein the computer usable program code comprises: computer usable codefor indexing a set of components in a data processing system accordingto corresponding amounts of cooling available to the components in theset, wherein an amount of cooling available to a component in the set ofcomponents is dependent upon a cooling configuration of the component inthe data processing system, and wherein the cooling configurationincludes a measure of a proximity of the component to a coolant inlet inthe data processing system; computer usable code for assigningpriorities to component users in a set of component users; and computerusable code for allocating, using a processor and a memory, a componentwhose index value represents a higher than threshold amount of coolingavailability to the component to a component user whose priority ishigher than a threshold priority.